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Table of Contents
 
Summary
United States
Europe
Japan
China
Other Asia
Introduction
Overview of the Semiconductor Industry
Global View
Semiconductor Markets
Semiconductor Manufacturing Industry
Polysilicon and Silicon Wafer Industry
Polysilicon
Manufacturers
Markets
Prices
Trends and strategic issues
Silicon wafers
Regional View
United States
Industry structure
Industry market trends
Electronic products
Semiconductors
Canada
Europe
Industry structure
Industry market trends
Japan
Industry Structure
Industry market trends
Electronic products
Semiconductors
China
Republic of Korea
Taiwan
Other Asia
Overview of the IC Process Chemicals Industry
United States
Market Size and Growth
Structure of the Industry
Company Profiles
DuPont
Rohm and Haas
Cabot Microelectronics
Operating Characteristics
Research and development
Manufacturing
Marketing and technical service
Cost structure and profitability
Government Regulations
Trends and Opportunities
Technology
Device density and miniaturization
Business
Critical Factors for Success
Europe
Market Size and Growth
Structure of the Industry
Company Profile - Wacker Group (Wacker Polysilicon, Siltronic AG)
Operating Characteristics
Research and development
EU research programs
Company initiatives
Marketing
Cost structure and profitability
Government Regulations
REACH
RoHS/WEEE directives (Restrictions of the Use of Hazardous Substances/Waste Electrical and Electronic Equipment)
Trends and Opportunities
Critical Factors for Success
Japan
Market Size and Growth
Structure of the Industry
Company Profiles
JSR Corporation
Shin-Etsu Chemical Company, Ltd.
Sumitomo Chemical Co., Ltd.
Taiyo Nippon Sanso Corporation
Operating Characteristics
Research and development
Manufacturing
Marketing
Cost structure and profitability
Government Regulations
Trends and Opportunities
Technology
Business
Critical Factors for Success
China
Market Size and Growth
Structure of the Industry
Operating Characteristics
Government Regulations
Critical Factors for Success
Other Asia
Semiconductor Manufacturing
Semiconductor Substrates
Processing Steps
Deposition
Patterning/Photolithography
Removal (Etching and Chemical Mechanical Planarization)
Modification of Electrical Properties/Implantation
Technology Trends
Moore's Law
More Moore
More than Moore
IC Process Chemicals - Product Types/Functions/Trends
Polycrystalline Silicon and Silicon Wafers
Technology and Manufacturing
Trends and Strategic Issues
Photoresists
Technology and Manufacturing
Purity Specifications
Trends and Strategic Issues
Photoresist Ancillaries
Wet Processing Chemicals
Etching
Cleaning
Purity Specifications
Trends and Strategic Issues
Chemical Mechanical Planarization (CMP) Slurries
CMP of Copper Layers
Trends and Strategic Issues
Atmospheric and Specialty Gases
Blanket and Carrier Gases
Etchant and Cleaning Gases
Dopant Gases Containing Group III/V Elements
Precursors for Silicon, Tungsten and Titanium Compounds
Reactants and Other Semiconductor Processes Using Specialty Gases
Technology and Manufacturing
Purity Specifications
Trends and Strategic Issues
Thin Film Metals (Metal Sputtering)
Technology and Manufacturing
Trends and Strategic Issues
Copper Plating Chemicals
Market Participants
Consumption and Pricing
Trends and Strategic Issues
Dielectric Materials
Low-k Dielectric Materials
Technology and manufacturing
Market participants
Consumption and pricing
Trends and strategic issues
High-k Dielectric Materials/Metal Gates
Market participants
Trends and strategic issues
Markets for IC Process Chemicals by Region
United States
Silicon
Consumption and markets
Market participants
Prices
Wafer recycling
Photoresists
Consumption and markets
Market participants
Prices
Photoresist Ancillaries
Wet Processing Chemicals
Consumption and markets
Market participants
Prices
Chemical Mechanical Planarization (CMP) Slurries
Consumption and markets
Market participants
CMP prices
Atmospheric (Bulk) and Specialty Gases
Consumption and markets
Market participants
Prices
Thin Film Metals (Metal Sputtering)
Consumption and markets
Market participants
Prices
Europe
Silicon
Consumption and markets
Market participants
Prices
Photoresists
Consumption and markets
Market participants
Prices
Wet Processing Chemicals and Ancillary Chemicals
Consumption and markets
Market participants
Prices
Chemical Mechanical Planarization (CMP) Slurries
Consumption and markets
Market participants
Prices
Atmospheric and Specialty Gases
Consumption and markets
Market participants
Prices
Thin Film Metals (Metal Sputtering)
Consumption and markets
Market participants
Japan
Silicon
Consumption and markets
Market participants
Prices
Photoresists and Ancillary Chemicals
Consumption and markets
Market participants
Prices
Wet Processing Chemicals
Consumption and markets
Market participants
Prices
Chemical Mechanical Planarization (CMP) Slurries
Consumption and markets
Market participants
Prices
Atmospheric and Specialty Gases
Consumption and markets
Market participants
Prices
Thin Film Metals (Metal Sputtering)
Consumption and markets
Market participants
Prices
Dielectric Materials
Low-k dielectric materials
Consumption and markets
Market participants
Prices
High-k dielectric materials
Consumption and markets
Market participants
Prices
China
Silicon
Consumption and markets
Market participants
Prices
Photoresists and Photoresist Ancillaries
Consumption and markets
Market participants
Prices
Wet Processing Chemicals
Consumption and markets
Market participants
Prices
Chemical Mechanical Planarization (CMP) Slurries
Consumption and markets
Prices
Atmospheric and Specialty Gases
Consumption and markets
Market participants
Prices
Thin Film Metals (Metal Sputtering)
Other Asia
Consumption and Markets
Market Participants
Silicon wafers
Photoresists
Wet processing chemicals
Chemical mechanical planarization (CMP) slurries
Atmospheric and specialty gases
Thin film metals
Low-k dielectric materials
Appendix
   
  Electronic Chemicals: Semiconductors, Silicon and IC Process Chemicals
   
  Uwe Fink and Larisa Dorfman and Yoshio Inoguchi and Wei Yang
  Published October 2008
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  Abstract
   
 

Sharp contrasts in growth rates reflect a persistent cycle in the semiconductor business even with no ups and downs of the economy. The cycle comprises significant capacity addition, declining average selling prices, weak market, reduced capital spending, little capacity addition, increasing average selling prices, strong market, and strong capital spending. While the duration of the cycles and their amplitude may or may not be shrinking, the up-and-down market has enormous impact on chipmakers and suppliers of semiconductor equipment and electronic chemicals in terms of capital spending and strategic planning.

The electronic industry uses a broad range of highly sophisticated specialty chemicals in many processing steps in the manufacture of electronic components and products, in silicon wafers and integrated circuits (IC), for packaging and printed circuit boards (PCBs), in the manufacture of compound semiconductors and optoelectronics, and in the production of flat panel display products. This report covers the major specialty chemicals consumed in the production of integrated circuits or silicon chips including silicon wafers, photoresists, ancillary chemicals, wet processing chemicals, CMP slurries, atmospheric and specialty gases, thin film metals, and new chemicals and materials such as copper plating chemicals and precursor materials for low-k and high-k dielectrics.

Growth in the consumption of IC process chemicals is driven by increases in installed fab capacity—which has more than doubled over the past seven years, with the bulk of the new capacity at the 65-180 nm nodes—and processed silicon wafer surface area as well as by more expensive chemicals consumed by the new technology nodes. An increased technology efficiency provided by the semiconductor equipment industry is leading to a lower material usage per silicon wafer surface area while simultaneously well-proven and mature product lines from photoresists, wet process chemicals, atmospheric gases, CMP slurries and sputtering targets experience severe price pressures.
The following graphic is a representation of semiconductor development in accordance with Moore’s Law, and the trend toward “more than Moore”:

Driven by Moore’s Law for more than forty years, the semiconductor industry is developing and producing ICs with increased computing speed and less power consumption at lower costs. This has been accomplished by fabricating smaller feature sizes, by utilizing larger silicon wafer substrates and through engineering lower defect rates. As transistor dimensions approached nanoscale dimensions (below 100 nanometers), traditional electronic chemicals such as monocrystalline silicon, silicon oxide, aluminum or wet process chemicals for etching and cleaning encountered certain limitations. Electronic chemical companies were driven to develop new chemicals and formulations that enabled better performance—showing higher selectivity during etching and cleaning, or providing higher conductivity or lower permittivity.

A technology that makes it possible to create transistor geometries with nanoscale dimensions is 193 nm deep UV lithography, and the semiconductor industry will push this technology to its limits in order to generate features as narrow as 45 nm and possibly 32 nm. New deposition processes for thin barrier and dielectric layers by CVD (chemical vapor deposition) and ALD (atomic layer deposition) necessitated the development of new synthesis routes to produce fairly exotic molecules, in particular precursor molecules for the deposition of low-k and high-k dielectrics, barrier layers to prevent the migration of copper, and capping and etch stop layers to protect underlying structures.

Integrating these new materials has brought many challenges that have delayed their introduction. The number of new materials used in the 65 nm and 45 nm generations will undoubtedly grow further when scaling is continued. As these new technologies emerge, the suppliers of electronic chemicals will have to choose which materials they wish to develop and which tool and IC manufacturer to cooperate with, and provided their development project is successful, knowing that their product may be required only for a short time and in limited quantities.

 
Company Information
 

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